Apply the Classification and Segmentation technology of Solomon SolVision AI image platform to identify defect features. First, use the Classification tool to judge whether the wafer has too many defects and eliminate the defective products that cannot be repaired. Then, use image processing technology to segment the wafer image, and use the Segmentation tool to detect the defects in the image, record their features, coordinates, area and other information, which greatly improves the efficiency of subsequent repairs.