Detecting Microcracks on the Side Wall of WLCSP
- Cognex's Deep Learning tools apply intelligent algorithms to learn the difference between normal structural layers and defects, enabling more effective detection of tiny cracks.
- Highly accurate detection can save good chip packages that may have been incorrectly classified as defective (NG), thereby increasing yield. Deep learning can find tiny cracks on WLCSP packages that may pass traditional inspection methods but fail prematurely in the field.
Computer Vision
Software / Hardware
Features
Use Cases
Vertical Specifics
Business Tags
Semiconductor
Use Cases
Solution Info Link
https://www.cognex.com/zh-tw/industries/electronics/semiconductors/detecting-micro-cracks-wafer-level-chip-scale-package
Seller
Detecting Microcracks on the Side Wall of WLCSP
Description
- Cognex's Deep Learning tools apply intelligent algorithms to learn the difference between normal structural layers and defects, enabling more effective detection of tiny cracks.
- Highly accurate detection can save good chip packages that may have been incorrectly classified as defective (NG), thereby increasing yield. Deep learning can find tiny cracks on WLCSP packages that may pass traditional inspection methods but fail prematurely in the field.
Vertical Specifics
Business Tags
Semiconductor
Use Cases
AI Category
Computer Vision
Data Source
No items found.
Hardware / Software
Software / Hardware
Solution Info Link
https://www.cognex.com/zh-tw/industries/electronics/semiconductors/detecting-micro-cracks-wafer-level-chip-scale-package
Features
Use Cases
Seller