Semiconductor Chip Encapsulation Process Underfill Defect Detection Solution

Apply the Segmentation technology of Solomon SolVision's AI image platform to build an AI learning module to automatically learn and detect the characteristics and location of crawling glue and overflowing glue. Combined with data augmentation technology, simulate the possible situations of adhesive overflow, so that AI can learn more feature patterns to improve accuracy. On the other hand, increasing the number of correct categories can improve the recognition strength and effectively reduce the interference of environmental factors.

Computer Vision
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Seller Name
Solomon
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Country
Taiwan
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Semiconductor Chip Encapsulation Process Underfill Defect Detection Solution
Description

Apply the Segmentation technology of Solomon SolVision's AI image platform to build an AI learning module to automatically learn and detect the characteristics and location of crawling glue and overflowing glue. Combined with data augmentation technology, simulate the possible situations of adhesive overflow, so that AI can learn more feature patterns to improve accuracy. On the other hand, increasing the number of correct categories can improve the recognition strength and effectively reduce the interference of environmental factors.

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Semiconductor
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Computer Vision
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Software
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Features
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Seller
Seller Name
Solomon
Past project(s)
Client(s)
Country
Taiwan
Specializes in
Seller Page