Post-Bonding Inspection of MINI LED Panels

Cognex's AI tools help minimize defects related to assembly processes in mini LED screen manufacturing, including solder volume and alignment of LED chips on bonding pads. The detection system uses a series of images representing both good and NG (defective) results during its training phase. It learns to tag notable defects while disregarding abnormal situations within acceptable tolerances. These tools are capable of precisely locating and identifying targeted inspection zones (ROIs) along with any potential critical defects present within those regions. Manufacturing managers can use this information to more efficiently manage the quality of displays, thereby reducing costs and increasing profitability.

Computer Vision
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Cognex
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Post-Bonding Inspection of MINI LED Panels
Description

Cognex's AI tools help minimize defects related to assembly processes in mini LED screen manufacturing, including solder volume and alignment of LED chips on bonding pads. The detection system uses a series of images representing both good and NG (defective) results during its training phase. It learns to tag notable defects while disregarding abnormal situations within acceptable tolerances. These tools are capable of precisely locating and identifying targeted inspection zones (ROIs) along with any potential critical defects present within those regions. Manufacturing managers can use this information to more efficiently manage the quality of displays, thereby reducing costs and increasing profitability.

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Optoelectronics/Panels
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Computer Vision
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Software / Hardware
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Seller Name
Cognex
Past project(s)
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Specializes in
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