Multi-Layer W/B 3D AOI Inspection Machine
- Die Bond / Wire Bond multi-layer Chip stacking measurement and inspection can be used, and the AI inspection system can be used to improve the detection accuracy rate to 99.99%
- Distance: arc height, gap between arcs, line spacing, etc., any measurement of plane or step distance
- Abnormality: Wire deviation, ball drop, broken wire and other appearance defects
Computer Vision
Software / Hardware
Features
Use Cases
Vertical Specifics
Business Tags
Semiconductor
Use Cases
Solution Info Link
https://www.uaa.com.tw/aoi-13.html
Seller
Multi-Layer W/B 3D AOI Inspection Machine
Description
- Die Bond / Wire Bond multi-layer Chip stacking measurement and inspection can be used, and the AI inspection system can be used to improve the detection accuracy rate to 99.99%
- Distance: arc height, gap between arcs, line spacing, etc., any measurement of plane or step distance
- Abnormality: Wire deviation, ball drop, broken wire and other appearance defects
Vertical Specifics
Business Tags
Semiconductor
Use Cases
AI Category
Computer Vision
Data Source
No items found.
Hardware / Software
Software / Hardware
Solution Info Link
https://www.uaa.com.tw/aoi-13.html
Features
Use Cases
Seller